I invest in Tech Early in NVIDIA and Tesla -- bought it way before it was cool. Firm Intel bull—betting big as Lip‑Bu Tan steers Intel’s comeback 🚀discord.gg/VcbCcuWRJoined November 2025
Since I missed out on posting the recent generational run that Intel has been on here are:
$INTC Intel’s Top 10 News Stories since late May and why they matter.
1. June 2nd. MediaTek goes all in on Intel EMIB-T exclusive for its next gen program. At Goldman Sachs Taiwan Day, MediaTek said its upcoming chips will use only Intel’s EMIB-T packaging, with tape out targeted Q4 2026 and mass production Q4 2027. This is tied to MediaTek’s work designing custom AI silicon for Google TPU-related accelerators. This validates EMIB-T as a strong alternative to $TSM CoWoS for AI chip packaging and gives Intel Foundry a major customer win in the high-margin advanced packaging space.
2. Computex around June 1 to 2. Intel launches Xeon 6+. Clearwater Forest on 18A. The first data center CPU built on Intel’s most advanced node. Up to 288 Efficient cores, 576MB L3 cache, optimized for high density, scale out cloud native and agentic AI workloads. This marks the first high-volume deployment of Intel’s 18A process in a data center CPU, proving the technology and boosting foundry credibility.
3. May 29th. The best investor in the world, Nancy Pelosi (supposedly her husband) make a bet on Intel. Disclosed around June 23 to 25, 2026. Nancy Pelosi buys 200 Intel March 19, 2027 50 dollar strike call options on May 29th. Value around 1 to 5 million dollar range. Deep ITM given then current prices. This high-profile long-dated bullish options bet adds influential sentiment support for the Intel story.
4. June 5th. Intel x $HTCI.NE Hitachi strategic collab on physical AI, advanced computing, and digital infrastructure. Manufacturing, energy, mobility and so on. This expands Intel into edge and industrial AI applications like robotics while opening co-development and foundry opportunities with Hitachi.
5. Around June 9th. Reports surface that $GOOGL Google booked Intel for packaging over 3 million TPUs in 2028. Stock popped on the news. This confirms what we already know which is Intel’s advanced packaging as a credible alternative for high-volume AI accelerators.
6. June 18th. Intel hires Seok Hee Lee, former CEO of SK hynix! As EVP of Intel Foundry. He leads advanced packaging, system integration, back end tech development, and back end manufacturing. Will report directly to Lip-Bu Tan. Lee had prior Intel tenure from 2000 to 2010. This brings world-class HBM and advanced packaging expertise exactly when Intel needs it most to compete in AI chip integration via EMIB-T and Foveros.
7. June 18th. President Trump announces via Truth Social post that $AAPL Apple has agreed to work with Intel to design and build chips in the US. Intel stock surged on the news.
8. Around June 10th. SK hynix testing EMIB-T compatibility with its HBM. This confirms memory integration works reliably with Intel’s packaging to the standards AI accelerators demand, supporting the full supply chain for chips like Google’s TPUs.
9. June 25th. Intel-backed AI inference focused chip startup, SambaNova. Reportedly plans to raise up to 1 billion dollars at around 10 billion dollar post money valuation. Massive step up from around 2.2 billion earlier in 2026 after its Series E. Intel holds around 9 percent stake via prior investments and LBT is Executive Chairman. This delivers a direct valuation gain on Intel’s strategic stake while strengthening its position in efficient AI inference and systems-level AI.
10. Analyst upgrades June 11th:
$BAC Bank of America upgraded Intel to Buy from Underperform and raised price target to 135 from 96. Other banks raised targets around the same time after the Google packaging news: Wells Fargo to 110, Mizuho to 128, Barclays to 100.
$INTC
"SAIMEMORY and Intel also aim to produce prototypes by Mar. 2028 and to commercialize in 2029. Rather than directly replacing the current fifth-generation HBM (HBM3E) or next-generation HBM (HBM4), it is more realistic to view ZAM as a competitor in the post-HBM market after 2029."
US-Japan-Taiwan unite on ZAM to challenge South Korea’s HBM lead biz.chosun.com/en/en-it/2026/…
Turnarounds don’t feel like headlines—they feel like long nights, tough tradeoffs, and listening closely to customers. We’re still early, but signals are shifting: AI is driving new demand, more companies are building with Intel, and momentum is building under @LipBuTan1. Not victory but progress. The real work is execution. Earning trust back, step by step. Via @nytimes@trippmickle
Important bits by the NYT on $INTC Foundry situation, and it interestingly resonates a lot with what I have been talking about:
"In May, Mr. Musk and Mr. Tan agreed that Intel would provide its technology to support a chip-making operation that Mr. Musk is developing called Terafab. And in recent months, Apple, which is among the world’s largest chip customers, agreed to begin manufacturing a small portion of its laptop chips at Intel’s factories as early as 2027, four people familiar with the confidential agreement said. Some smartphone chips may follow"
- $AAPL intends to place orders in H1 2027, likely around the 18A-P node. Initial commitment would be on a limited scale, likely accounting for less than a billion in external revenue for the foundry service, based on what I have researched/talked about.
"In the agreement with Nvidia, each company will be selling the product, which means the amount of money that Intel makes on each chip can depend on who sells it, said three people close to the company, speaking on the condition of anonymity to discuss the confidential agreement.
The agreements with Mr. Musk and Apple hinge on Intel’s progress with a new manufacturing process it is developing called 14A. This fall, it has promised to deliver those companies a toolkit to test the technology before final commitments, one of the people close to Intel said."
- NYT's talk on the $NVDA deal with Intel likely focuses on the consumer x86 chip partnership, and specifically about how both Intel and NVIDIA will structure a deal with OEMs, which would likely involve a revenue-sharing mechanism.
- Another interesting fact disclosed is that 14A PDKs, likely 0.9, are set to be delivered to both Apple and $SPCX, implying that 14A isn't just limited to TeraFab, rather Apple is showing interest as well.
Overall, the foundry turnaround is still in its most critical phase, which is customer sampling and commitments. It's more about how US fabless customers intend to position their wafer orders, and strike a balance between TSMC and other partners right now.
As soon as PDK sampling goes great, and Intel shows the commitment to hike CapEx, and eventually expand production lines, it will be a step in the right direction.
Next stop: Intel's approach towards the capital markets.
The market thinks hyperscaler capex is a mistake.
It’s not.
$META, $AMZN & $MSFT aren’t spending because they’re forced to.
They’re spending because demand for compute is breaking supply.
We are not in a “capex bubble.”
We are in a capacity shortage.
Bill Ackman gets it.
Most of the market doesn’t.
There's a story behind every new processor. Coming soon: an inside look at the people, challenges, and engineering involved in creating Intel Core Ultra Series 3 processors, codenamed Panther Lake.
Telecom is at an inflection point. Intelligence is no longer centralized, it’s moving across core, RAN, edge, and transport. Scaling AI in this distributed world demands a new compute model—one that delivers performance without excess cost or power. Our latest @intel paper breaks down the shift and what comes next: intel.com/content/www/us…
The current analyst consensus continues to reflect a surprising disconnect from what Intel is actually doing and, more importantly, its demonstrated execution over the past several quarters.
My valuation models indicate that Intel remains materially undervalued relative to its semiconductor peers. If the company continues to execute on its roadmap at the current pace, I believe the market will ultimately re-rate the stock. By 2027, today’s consensus may be remembered as a case of the Street underestimating both Intel’s execution and the earnings power of its transformation.
Here's my deep dive on the $INTC 18A-P process, and I call it America's 'Crown Jewel'.
There's a lot that I talked about, but here are the main sections of the report:
- When exactly did 18A-P become a thing?
- What’s behind the extra “-P” and why derivatives matter
- 18A-P under the hood: PowerVia, Power Boost, and dual-contact architecture
- Apple, customer TAM, WPM figures, and CapEx implications
- Why Intel is operating one step at a time under Lip-Bu Tan
The 18A-P is the process to watch; it's none other. And as always, there's a visualizer as well, showing you how big an improvement the process brings over the base 18A process.
Link: semivisualizers-by-zuhair.vercel.app
Here's my deep dive on the $INTC 18A-P process, and I call it America's 'Crown Jewel'.
There's a lot that I talked about, but here are the main sections of the report:
- When exactly did 18A-P become a thing?
- What’s behind the extra “-P” and why derivatives matter
- 18A-P
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